| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which enables die bonding, without causing voids to be generated in a bonding plane. <P>SOLUTION: A vacuum supply line connected to a suction port formed on the bottom face of a suction collet 105 for supplying decompression force for vacuum-sucking a chip 1C to the suction collet 105 is formed with two systems. In other words, the vacuum supply line has a structure where a pipe 121 for supplying, to the suction collet 105, a vacuum which becomes a suction force, when separating the chip 1C from a dicing tape and then carrying the chip 1C to a mounting position on a wiring board; and a pipe 122 for supplying vacuum to the suction collet 105 which will serve as a suction force when mounting the chip 1C on the wiring board, are connected to the suction collet 105. The degree of vacuum (suction force) that is supplied to the suction collet 105 is controlled by opening/closing valves 123 and 124 is attached to the pipes 121 and 122, respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT |
