| 摘要 |
<p>An exposure apparatus is provided to remove particles on a rear of a wafer and a local defocus on the wafer by using a fixed chuck provided with an adhesive mat. A fixed chuck(110) receives a wafer of which a photoresist layer is coated, from a track equipment. An alignment chuck(120) aligns the wafer to a photo mask. The alignment chuck receives the wafer to perform a measurement process such as a pre-alignment, a global alignment, a leveling, a focusing, and rotation on the wafer. An exposure chuck(130) is used for irradiating light onto the aligned wafer. An adhesive mat(115) is provided on a surface of the fixed chuck. Particles residing on a rear of the wafer are attached to the adhesive mat of the fixed chuck.</p> |
