| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device which polishes a wafer with a polishing pad to a uniform thickness from its polished surface. <P>SOLUTION: Processing areas of the work are sectioned as wafer rings concentrically with a center of rotation, and the wafer is polished by positioning the polishing pads at the respective wafer rings so that the processing position changes. At this time, a processing time control means 130 controls processing times T<SB>i</SB>for which the wafer is polished by positioning the polishing pad at the respective rings, so that processing quantities by the wafer rings are the same. <P>COPYRIGHT: (C)2008,JPO&INPIT |
