| 摘要 |
In one embodiment, an electronic device package ( 1 ) includes a leadframe ( 2 ) with a flag ( 3 ). An electronic chip ( 8 ) is attached to the flag ( 3 ) with a die attach layer ( 9 ). A trench ( 16 ) having curved sidewalls is formed in the flag ( 3 ) in proximity to the electronic chip ( 8 ) and surrounds the periphery of the chip ( 8 ). An encapsulating layer ( 19 ) covers the chip ( 8 ), portions of the flag ( 3 ), and at least a portion of the curved trench ( 16 ). The curved trench ( 16 ) reduces the spread of die attach material across the flag ( 3 ) during chip attachment, which reduces chip and package cracking problems, and improves the adhesion of encapsulating layer ( 19 ). The shape of the curved trench ( 16 ) prevents flow of die attach material into the curved trench ( 16 ), which allows the encapsulating layer ( 19 ) to adhere to the surface of the curved trench ( 16 ).
|
