| 摘要 |
Methods for bonding include deposition of an adhesion layer on at least one substrate using chemical vapor deposition. The two adhesion layers each have a reactive group that is complementary to the other, thus enabling strong adhesion between the bonded substrates. Devices include two substrates that can be adhered together by chemically depositing an adhesion layer on at least one substrate using chemical vapor deposition. The substrates each have a reactive group that is complementary to the other, thus enabling strong adhesion between the bonded substrates.
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