发明名称 Tool for semiconductor package
摘要 A tool for aligning a semiconductor package with an electrical connector, comprises a body, a plurality of latching members assembled to the body and a back plane. The body defines a center through hole which has a funnelform casing at bottom end thereof for aligning and guiding the semiconductor package. The latching member has a latching portion for retaining the tool to the electrical connector.
申请公布号 US2007281509(A1) 申请公布日期 2007.12.06
申请号 US20070810244 申请日期 2007.06.05
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 CHEN MING-YUE
分类号 H01R12/00 主分类号 H01R12/00
代理机构 代理人
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