| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical device package capable of performing the dicing division on outer dimensions of the optical device and miniaturizing the device in the same dimensions while performing the break division on individual pieces of the optical device. <P>SOLUTION: The optical device package by laminating a plurality of ceramic layers 101, 102, 103 on a base section 2 to form a recess 18 on which an optical device is mounted at a center thereof, wherein burring preventive reverse R sections 11 are formed at corners of the ceramic layers 100, 101, 102 so as to allow a shape of at least one corner or more out of four corners in the ceramic layers of the uppermost layer to be positioned outside external shapes of the ceramic layers 100, 101, 102 as viewed from the center. <P>COPYRIGHT: (C)2008,JPO&INPIT |
