| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a SIP module which is easy to miniaturize and thin. <P>SOLUTION: This SIP module comprises a printed circuit board in which at least one cavity is formed, at least one first element mounted in the cavity, a circuit pattern which is formed on a bottom surface of the cavity to be electrically connected to the first element, and at least one second element mounted on the printed circuit board surface facing the bottom surface of the cavity. <P>COPYRIGHT: (C)2008,JPO&INPIT |
