| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which the process can be simplified. <P>SOLUTION: In a preparation step, a core substrate 11 and an electronic component 101 are prepared. In an insulation layer forming and securing step; a lowermost resin insulation layer 33 is formed after an electronic component 101 is contained in a containing hole 90, and then the electronic component 101 is secured to the core substrate 11 by filling the clearance between the electronic component 101 and the core substrate 11 with a portion of the lowermost resin insulation layer 33. In an opening forming step, a portion of the lowermost resin insulation layer 33 directly above the clearance between the electronic component 101 and the core substrate 11 is removed to form an opening for exposing part of a core substrate major surface side conductor 51 and a component major surface side electrode 111. In a major surface side connection conductor forming step, a major surface side connection conductor 61 is formed in the opening to connect the core substrate major surface side conductor 51, and the component major surface side electrode 111. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
