发明名称 |
PRINTED CIRCUIT BOARD, FORMING METHOD THEREFOR, AND INTER-BOARD CONNECTING STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing a deterioration from occurring in peeling strength of a connection terminal and an insulating layer and a short circuit caused by a reservoir of excessive solder, and capable of improving connection strength between connection terminals without obstructing a reduction in a pitch between circuits. SOLUTION: The printed circuit board comprises: an insulating layer 10; a conductive circuit 11 arranged on the insulating layer 10 and equipped with connection terminals 12 at its edge; and projections 13 each provided on the connection terminal 12 in the direction in which the conductive circuit 11 is extended. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007317851(A) |
申请公布日期 |
2007.12.06 |
申请号 |
JP20060145389 |
申请日期 |
2006.05.25 |
申请人 |
FUJIKURA LTD |
发明人 |
KITADA TOMOHITO;MARUO HIROKI |
分类号 |
H05K1/11;H05K1/14 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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