| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board where a conductive circuit can be formed to high density, and which can prevent migration. SOLUTION: The wiring board 10 comprises a substrate 11, the conductive circuit 12 formed on one surface 11a of the substrate 11, and an insulating layer 13 which covers the conductive circuit 12. At the engagement part 14 of the wiring board 10, an opening 15 which exposes a portion of the conductive circuit 12 is formed in the insulating layer 13. At the opening 15, a portion of the conductive circuit 12 is exposed as an exposed surface 12a in the insulating layer 13. On the exposed surface 12a exposed by the opening 15, the conductive circuit 12 comes into contact with a contact 22 that a connector 21 has. COPYRIGHT: (C)2008,JPO&INPIT
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