| 摘要 |
In a method for fabricating a semiconductor device, a first region in a semiconductor substrate is formed with a first-gate-electrode formation portion composed of a first silicon film, a second silicon film, and a second protective film, and a second region therein is formed with a second-gate-electrode formation portion composed of the first silicon film, a first protective film, the second silicon film, and the second protective film. Then, the first-gate-electrode formation portion is formed into a first fully silicided gate electrode, and the second-gate-electrode formation portion is formed into a second fully silicided gate electrode.
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