发明名称 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 A circuit board and a manufacturing method thereof are provided. First, the circuit board has a coaxial signal trace that comprises a conductive line and conductive wall. The conductive wall surrounds part or all of the conductive line. Additionally, the circuit board has a plurality of circuit layers where the coaxial signal trace is located. Secondly, the method for manufacturing the circuit board has several steps including using a module to form a pattern that is made for the circuit layers where part of the conductive wall is encompassed. In the end, through the present invention, the problems from the high frequency signal transmission in electronic apparatus can be solved or reduced.
申请公布号 US2007278661(A1) 申请公布日期 2007.12.06
申请号 US20060464666 申请日期 2006.08.15
申请人 VIA TECHNOLOGIES, INC. 发明人 HSU CHI-HSING
分类号 H01L23/12 主分类号 H01L23/12
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