发明名称 PLASMA CVD METHOD, METHOD FOR FORMING SILICON NITRIDE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>A plasma processing apparatus generates plasma by introducing microwaves into a processing chamber by using a planar antenna having a plurality of slots. By using the plasma processing apparatus, a nitrogen containing gas and a silicon containing gas introduced into the processing chamber are brought into the plasma state, and at the time of depositing by using the plasma a silicon nitride film on the surface of a substrate to be processed, stress to the silicon nitride film to be formed is controlled by the combination of the type and the processing pressure of the nitrogen containing gas.</p>
申请公布号 WO2007139140(A1) 申请公布日期 2007.12.06
申请号 WO2007JP60974 申请日期 2007.05.30
申请人 TOKYO ELECTRON LIMITED;KOHNO, MASAYUKI;NISHITA, TATSUO;NAKANISHI, TOSHIO 发明人 KOHNO, MASAYUKI;NISHITA, TATSUO;NAKANISHI, TOSHIO
分类号 C23C16/42;C23C16/511;H01L21/318 主分类号 C23C16/42
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