发明名称 PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a structure which is capable of preventing an NSMD land from being disconnected from a wiring pattern on a printed wiring board equipped with the NSMD land and the wiring pattern on its surface, and also preventing the land from separating from a board. <P>SOLUTION: The printed wiring board is equipped with a wiring pattern 18 and a land 10 that is formed in an opening 19 provided to a protective film 16 covering the wiring pattern 18, and located separating from the contour of an opening 19. An auxiliary wiring pattern 20 is composed of a first auxiliary wiring pattern 13 surrounding the land 10 and a second auxiliary wiring pattern 12 that extends in a radial manner from the land 10, is connected to the first auxiliary wiring pattern 13, and is arranged so as to enable the first auxiliary wiring pattern 13 to be located below the protective film 16. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007317842(A) 申请公布日期 2007.12.06
申请号 JP20060145245 申请日期 2006.05.25
申请人 ELPIDA MEMORY INC 发明人 KONDO TAKESHI
分类号 H05K3/34 主分类号 H05K3/34
代理机构 代理人
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