发明名称 |
CIRCUIT APPARATUS, AND SURFACE MOUNTING COIL |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a miniaturized circuit apparatus where quality is stabilized, and to provide a surface mounting coil. <P>SOLUTION: The circuit apparatus 10A has a multilayered wiring layer. A coil wiring formed of the wiring layer patterned in a C shape forms winding of a coil. A coil 12 formed of a first wiring layer 13 and the like is formed in a part of the wiring board 11. An insulating layer whose thickness is several 50μm to 200μm is located between coil wiring parts. Relative positions in a thickness direction of the coil wiring parts are fixed by the insulating layer and they do not move. Thus, performance of the coil 12 formed of the coil wiring parts is stable as the coil since the coil wiring parts equivalent to winding of the coil do not move. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2007317838(A) |
申请公布日期 |
2007.12.06 |
申请号 |
JP20060145195 |
申请日期 |
2006.05.25 |
申请人 |
SANYO ELECTRIC CO LTD |
发明人 |
IIMURA TOSHIYUKI;OSUMI KAZUNARI;SAKUMA YUKINAO;ICHIHASHI JUNICHI |
分类号 |
H05K3/46;H01F17/00;H01F17/04;H01L23/12 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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