| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for applying a photoresist, by which a photoresist layer made thicker as it goes to the outer peripheral side of a substrate from the inner peripheral side can be easily formed on the substrate at a low cost. <P>SOLUTION: The method for applying the photoresist comprises: a heating step of heating the substrate uniformly; a heat absorption step of placing the heated substrate on a turntable having the diameter smaller than that of the substrate so that the inner peripheral side of the heated substrate abuts on the turntable, so that the heat in the vicinity of an abutted part of the substrate on the turntable is absorbed in the turntable; and an application step of applying the photoresist onto the substrate while rotating the turntable on which the substrate is placed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
