| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method in which dishing is prevented for a film on a substrate, or to provide a process for manufacturing a semiconductor device. SOLUTION: The polishing method comprises steps (S202) of: rotating a polishing cloth 525 arranged on a turntable 520 together with the turntable 520; and (S206) polishing the surface of a substrate 300 using the rotating polishing cloth 525, while supplying chemical 540 to touch the surface of the polishing cloth 525 on this side of the substrate 300 from a direction oblique to the surface of the polishing cloth 525. According to the polishing method, supply of chemical 540 is reduced. COPYRIGHT: (C)2008,JPO&INPIT |
