发明名称 COMPOSITE COMPOSITION, MOLDING OF THE COMPOSITE COMPOSITION AND MANUFACTURING PROCESS OF THE COMPOSITE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composite resin composition having an excellent heat resistance and containing a polylactic acid. SOLUTION: The composite resin composition comprises a first resin phase with a softening point of T<SB>1</SB>and a second resin phase with a softening point of T<SB>2</SB>. The second resin phase contains a substance plasticizing the first resin phase. T<SB>2</SB><T<SB>1</SB>. The first resin is a composite resin of a modified polyphenylene ether and a polystyrene. The second resin is a polylactic acid. A carbodiimide compound is blended with the composition as a hydrolysis inhibitor. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007314656(A) 申请公布日期 2007.12.06
申请号 JP20060145306 申请日期 2006.05.25
申请人 SONY CORP 发明人 AOKI YUYA;NOGUCHI TSUTOMU;MORI HIROYUKI;YAMADA SHINICHIRO;FUJIHIRA HIROKO
分类号 C08L101/12;C08L25/04;C08L67/04;C08L71/12 主分类号 C08L101/12
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