| 摘要 |
A spin head and a method for holding/unholding a wafer using the same are provided to minimize the contact of the wafer by using holding pins, and to treat the entire surface of the wafer uniformly. A plate(100) is located at a lower portion of a substrate, when performing a process. A plurality of first holding pins(120a,120b,120c) and a plurality of second holding pins(140a,140b,140c) are installed on the plate along the edge of the plate, and prevent the substrate from being separated from the upper portion of the plate. The holding pins are contacted and separated alternately to a side part of the substrate, so that a driving unit is driven by magnetic force to hold and unhold the substrate.
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