| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive resin laminate having excellent adhesion to a glass substrate in hydrofluoric acid etching of the glass substrate. <P>SOLUTION: The photosensitive resin composition comprises (A) a binder resin having a carboxyl group content of 100-600 in terms of acid equivalent and a weight average molecular weight of 5,000-500,000, (B) a photopolymerizable monomer having at least one terminal ethylenically unsaturated group, (C) a photopolymerization initiator and (D) an organosilane compound, wherein the component (D) is a specific organosilane compound. <P>COPYRIGHT: (C)2008,JPO&INPIT |
