| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a polishing pad which is useful for the in-situ detection of an end point by means of an optical method and useful for polishing a wafer on which an IC is mounted, and such a pad. <P>SOLUTION: The pad includes a first part formed of a first resin and a second part formed of a second resin. the first part is formed of a hard homogeneous resin sheet with no intrinsic ability to absorb or transport slurry particles and transparent to a light beam having a wavelength within a range of 190 to 3,500 nm, and the first part and the second part have the same desired thicknesses. While either the first resin or the second resin remains to be liquid, this resin is brought in full contact with the other resin, and afterward, the resin in a liquid state is cured to join the first part and the second part. <P>COPYRIGHT: (C)2008,JPO&INPIT |
