| 摘要 |
PROBLEM TO BE SOLVED: To provide an aggregate of interconnections for enabling the measurement of the electrical property of each individual substrate members, and also to provide a wiring board obtained therefrom. SOLUTION: The aggregate of interconnections 1 include: a plurality of substrate members 6 each defined by split grooves 4; a plurality of oval through holes 5 formed to along the above of split grooves 4 generally perpendicular thereto; and a conductive member formed in the center portion of the inner circumference plane of each substrate portions 6 facing the through hole 5, while electrically conducted with the interconnection pattern of each substrate members 6. The plurality of conductive members in each substrate members 6 is insulated each other, so that the measurement of the electrical property of individual substrate members 6 is performed on the aggregate substrate 1. COPYRIGHT: (C)2008,JPO&INPIT
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