| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device mounting body for effectively reducing an inductance of a power supply or a ground path with a simplified structure. SOLUTION: The semiconductor device is constituted in the structure that a semiconductor chip 3 is mounted on a flexible base material 1f on which a conductor wire 1d is arranged, and that a signal is outputted to an external side from a semiconductor chip through the conductor wire. In this semiconductor device, a grounding terminal of the semiconductor chip is mounted in such manner that it is grounded to a conductor chassis 5 of a set device for which the function of semiconductor chip is used. The grounding terminal of the semiconductor chip is connected to a ground wire of the conductor wire, the semiconductor device is coupled with the conductor chassis via a metal heat radiating plate 2, and the grounding wire is arranged to be in contact with the metal heat radiating plate. Accordingly, the grounding terminal is grounded to the conductor chassis via the conductor wire and metal heating radiating plate. COPYRIGHT: (C)2008,JPO&INPIT
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