| 摘要 |
A semiconductor acceleration sensor of the invention comprises: a sensor chip having a pad formation surface around whose edge are formed a plurality of pads, and in which a rectangular frame shaped protrusion is formed on an area of the pad formation surface on a center side of the pads; and a control chip which has a terminal formation surface on which connection terminals are formed, and has a planar shape such that the pad of the sensor chip is visible from the terminal formation surface side. Moreover, the opposite surface of the control chip to the terminal formation surface is bonded to the frame shaped protrusion of the sensor chip.
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