发明名称 Semiconductor device having trench charge compensation regions and method
摘要 In one embodiment, a semiconductor device is formed having charge compensation trenches in proximity to channel regions of the device. The charge compensation trenches comprise at least two opposite conductivity type semiconductor layers. A channel connecting region electrically couples the channel region to one of the at least two opposite conductivity type semiconductor layers.
申请公布号 US2007278592(A1) 申请公布日期 2007.12.06
申请号 US20060442733 申请日期 2006.05.30
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 TU SHANGHUI LARRY;GRIVNA GORDON M.
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
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