| 摘要 |
<p>Disclosed is a wiring board comprising a substrate, a conductive circuit formed on one surface of the substrate, and an insulating layer covering the conductive circuit. An opening is formed in a fitting portion of the wiring board so that a part of the conductive circuit is exposed from the insulating layer. Namely, a part of the conductive circuit is exposed, as an exposed surface, from the insulating layer in the opening. An electrode composed of a conductive material is formed on the exposed surface of the conductive circuit. The lower surface of the electrode is connected with the conductive circuit, while the upper surface of the electrode extends in the wiring width direction W of the conductive circuit in such a manner that a part of the insulating layer is covered therewith.</p> |
