摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which comprises a flexible vinyl chloride resin substrate, shows a high expandability, prevents transfer of a deposit from the substrate to an adherend, and is useful as a sheet for holding a semiconductor wafer and an electronic part, etc. SOLUTION: The pressure-sensitive adhesive sheet is manufactured by stacking a release layer side of a release film on the surface of an adhesive layer of a pressure-sensitive adhesive film. The pressure-sensitive adhesive film has the adhesive layer on at least one side of a substrate layer made of a flexible vinyl chloride containing at least one compound chosen from a fatty acid compound, an aliphatic metal salt and a phosphate, and the release film comprises a liner substrate and the release layer. The surface free energy of the surface at the release layer side of the release film is 20 dyn/cm or larger but smaller than 30 dyn/cm. COPYRIGHT: (C)2008,JPO&INPIT |