发明名称 PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which comprises a flexible vinyl chloride resin substrate, shows a high expandability, prevents transfer of a deposit from the substrate to an adherend, and is useful as a sheet for holding a semiconductor wafer and an electronic part, etc. SOLUTION: The pressure-sensitive adhesive sheet is manufactured by stacking a release layer side of a release film on the surface of an adhesive layer of a pressure-sensitive adhesive film. The pressure-sensitive adhesive film has the adhesive layer on at least one side of a substrate layer made of a flexible vinyl chloride containing at least one compound chosen from a fatty acid compound, an aliphatic metal salt and a phosphate, and the release film comprises a liner substrate and the release layer. The surface free energy of the surface at the release layer side of the release film is 20 dyn/cm or larger but smaller than 30 dyn/cm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007314636(A) 申请公布日期 2007.12.06
申请号 JP20060144498 申请日期 2006.05.24
申请人 NITTO DENKO CORP 发明人 OKAWA YUJI
分类号 C09J7/02;B32B27/00;B32B27/32;H01L21/301 主分类号 C09J7/02
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