| 摘要 |
PROBLEM TO BE SOLVED: To provide a double layer plated copper polyimide substrate which is excellent in initial bonding strength, heat resistant bonding strength and PCT bonding strength. SOLUTION: A structure is formed in which a polyimide surface evaluated by a method of coloring with an aqueous solution of silver nitride and observing a cross section with a transmission electron microscope (TEM) has a modified thickness of 200Åor low, a seed layer made of nickel, chrome or an alloy of these is formed on the polyimied surface, and then, a copper layer is formed by using electric copper plating, non-electrolytic copper plating or the both. By employing this structure, the double layer plated copper polyimide substrate in which the initial bonding strength, the heat resistant bonding strength after being left in the atmosphere of 150°C for 168 hours and the PCT bonding strength after a PCT test at 121°C, 95%, 2 atmospheric pressure for 100 hours are all 400 N/m or more can be obtained. COPYRIGHT: (C)2008,JPO&INPIT |
