| 摘要 |
PROBLEM TO BE SOLVED: To provide a scrubbing cleaning method and a scrubbing cleaning system by which satisfactory cleaning can be performed even when various kinds of foreign materials adhere to a substrate. SOLUTION: A roll brush 1 formed substantially in a cylindrical shape is set on the backside of a semiconductor wafer W, in such a way that an additive 3 can be supplied from its inside toward the backside of the semiconductor wafer W. Also, a mechanism is provided for supplying a deionized water 2 as a cleaning liquid to the front side and the backside of the semiconductor wafer W. The additive 3 is neutral or acid. The interfacial electrokinetic potential of the foreign materials adhering to the semiconductor wafer W and the interfacial electrokinetic potential of the roll brush 1 are controlled to be of the same polarity. In this way, the foreign materials adhering to the semiconductor wafer W and the roll brush 1 are electrostatically repulsive. COPYRIGHT: (C)2008,JPO&INPIT
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