| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component housing package wherein foreign matter is easily and securely removed from a recess for housing any electronic component including corners of the recess. SOLUTION: The electronic component housing package 10 comprises an insulating substrate 1 with the recess 1a polygonal-shaped in a plan view; a mounting surface 1b provided inside the recess 1a, on which an electronic component is mounted; and a wiring conductor 2 formed in the insulating substrate 1, so as to be derived from the inside of the recess 1a to the outside. The insulating substrate 1 includes an indentation 3 at the corners in the recess 1a reaching both side surfaces. Turbulence and spiral flow are produced at the indentation 3 when sucking the inside of the recess 1a, so that foreign matter easily moves from the indentation 3 and its surroundings and so any foreign matter can be easily and securely removed from the recess 1a. COPYRIGHT: (C)2008,JPO&INPIT
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