AU-AG BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE

摘要

A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5~15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10~40 wt % of Ag added to Au.