发明名称 SLURRY COMPOSITION, METHOD OF POLISHING USING THE SLURRY COMPOSITION AND METHOD OF MANUFACTURING A NON-VOLATILE MEMORY DEVICE
摘要 A slurry composition is provided to ensure a high polishing selectivity ratio of a hydrophilic layer to a hydrophobic layer. A slurry composition comprises: a ceria abrasive; a non-ionic surfactant which has a hydrophilic lipophilic balance value of 12-17 and adsorbs to the surface of a hydrophobic layer to protect the hydrophobic layer from the ceria abrasive; and water. A polishing method includes the steps of: forming a polishing stop layer on a substrate; forming a polishing target layer on the polishing stop layer; and providing the slurry composition to a polishing pad and bringing the surface of the polishing pad into contact with the surface of the polishing target layer to polish the polishing target layer until the polishing stop layer is exposed.
申请公布号 KR20070115438(A) 申请公布日期 2007.12.06
申请号 KR20060049882 申请日期 2006.06.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HAN, EUI JIN;KIM, NAM SOO;AHN, BONG SU;LEE, DONG JUN
分类号 C09K3/14 主分类号 C09K3/14
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