| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board which can easily prevent a resin from staying in a via hole without conducting a permanganate treatment, when forming the via hole for electrically connecting interconnection metal layers arranged with an insulation layer between by laser processing, and to provide its manufacturing method. SOLUTION: The method of manufacturing the printed circuit board comprises a metal layer formation process wherein a metal layer 17 dissoluble in an acid more easily than a copper foil 18, and still dissoluble in an acid easily, even if it becomes an oxide, is formed on the copper foil 18 formed on an insulation substrate 12; and an interconnection metal layer formation process wherein, after the metal layer formation process, a circuit pattern formation process is conducted on the copper foil to form internal circuits 13a and 13b on the insulation substrate 12. This manufacturing method also includes an insulation layer formation process wherein, after the interconnection metal layer formation process, insulation layers 14a and 14b for covering the internal circuits 13a and 13b are formed; and a via formation process wherein a laser beam is irradiated on the insulation layers 14a and 14b to form a hole 23 which reaches the metal layer 17 or the internal circuits 13a and 13b. COPYRIGHT: (C)2008,JPO&INPIT |
