| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Ni-Si-based alloy which is excellentin plating adhesion. SOLUTION: By mass, 10 to 100 ppm Al is added to a copper alloy comprising 1.0 to 4.5% Ni and 0.2 to 1.0% Si, and the concentration of Al in the surface is controlled to 0.01 to 0.5%, thus a Cu-Ni-Si-based alloy excellent in plating adhesion can be obtained. The Cu-Ni-Si-based alloy may contain one or more selected from Mg, Zn, Sn, P, Ag, Mn, Co and Cr by 0.005 to 3.0% in total. COPYRIGHT: (C)2008,JPO&INPIT
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