发明名称 |
Super miniature dual battery contact module for e.g. headphone, has plastic frame that is fastened at contact springs and comprises guiding pins or guiding borehole for fixing module on printed circuit board |
摘要 |
<p>The module (10) has electrical contact springs (2, 3, 4, 5) that are made of rust-free steel, and a plastic frame (1) that is fastened at the contact springs and is made of liquid crystal polymer. The plastic frame has a borehole (8) or a projecting mounting unit that is used for fastening the module at a housing of a hearing device. The plastic frame has guiding pins (6, 7) or a guiding borehole for fixing the module on a printed circuit board.</p> |
申请公布号 |
DE102006026753(B3) |
申请公布日期 |
2007.12.06 |
申请号 |
DE20061026753 |
申请日期 |
2006.06.08 |
申请人 |
SIEMENS AUDIOLOGISCHE TECHNIK GMBH |
发明人 |
HEERLEIN, MARKUS;KASZTELAN, THOMAS;ONG, VINCENT |
分类号 |
H04R25/00;H01M2/10;H01M2/30;H01R4/48 |
主分类号 |
H04R25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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