发明名称 Super miniature dual battery contact module for e.g. headphone, has plastic frame that is fastened at contact springs and comprises guiding pins or guiding borehole for fixing module on printed circuit board
摘要 <p>The module (10) has electrical contact springs (2, 3, 4, 5) that are made of rust-free steel, and a plastic frame (1) that is fastened at the contact springs and is made of liquid crystal polymer. The plastic frame has a borehole (8) or a projecting mounting unit that is used for fastening the module at a housing of a hearing device. The plastic frame has guiding pins (6, 7) or a guiding borehole for fixing the module on a printed circuit board.</p>
申请公布号 DE102006026753(B3) 申请公布日期 2007.12.06
申请号 DE20061026753 申请日期 2006.06.08
申请人 SIEMENS AUDIOLOGISCHE TECHNIK GMBH 发明人 HEERLEIN, MARKUS;KASZTELAN, THOMAS;ONG, VINCENT
分类号 H04R25/00;H01M2/10;H01M2/30;H01R4/48 主分类号 H04R25/00
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