发明名称 Piezo-actuator encapsulation manufacturing method involves applying electrical insulating layer on surface of piezo-actuator, where hermetically sealed surface layer is superimposed on insulating layer
摘要 <p>The method involves applying an electrical insulating layer (10) on a surface (20) of a piezo-actuator (5), which runs parallel to its longitudinal or stacking direction (30). A hermetically sealed surface layer is superimposed on the insulating layer, so that the hermetically sealed surface layer covers the insulating layer in a plane. The insulating layer has an organic coating, preferably a polymer or elastomer coating and/or an inorganic coating, preferably of glasses, ceramics, oxides or nitrides. An independent claim is also included for a piezo-actuator with encapsulation, particularly a multilayer actuator.</p>
申请公布号 DE102006025172(A1) 申请公布日期 2007.12.06
申请号 DE20061025172 申请日期 2006.05.30
申请人 SIEMENS AG 发明人 BACHMAIER, GEORG;EBELSBERGER, GERIT;GOEDECKE, ANDREAS;HENNIG, OLIVER;KASPAR, MICHAEL;MAGORI, ERHARD;SCHUH, CARSTEN
分类号 F02M51/06;H01L41/273;H02N2/04 主分类号 F02M51/06
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