发明名称 |
Piezo-actuator encapsulation manufacturing method involves applying electrical insulating layer on surface of piezo-actuator, where hermetically sealed surface layer is superimposed on insulating layer |
摘要 |
<p>The method involves applying an electrical insulating layer (10) on a surface (20) of a piezo-actuator (5), which runs parallel to its longitudinal or stacking direction (30). A hermetically sealed surface layer is superimposed on the insulating layer, so that the hermetically sealed surface layer covers the insulating layer in a plane. The insulating layer has an organic coating, preferably a polymer or elastomer coating and/or an inorganic coating, preferably of glasses, ceramics, oxides or nitrides. An independent claim is also included for a piezo-actuator with encapsulation, particularly a multilayer actuator.</p> |
申请公布号 |
DE102006025172(A1) |
申请公布日期 |
2007.12.06 |
申请号 |
DE20061025172 |
申请日期 |
2006.05.30 |
申请人 |
SIEMENS AG |
发明人 |
BACHMAIER, GEORG;EBELSBERGER, GERIT;GOEDECKE, ANDREAS;HENNIG, OLIVER;KASPAR, MICHAEL;MAGORI, ERHARD;SCHUH, CARSTEN |
分类号 |
F02M51/06;H01L41/273;H02N2/04 |
主分类号 |
F02M51/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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