发明名称 THE METHOD OF VOID FREE FOR MOLDING PRODUCT
摘要 <p>Disclosed is a method of removing voids from a molded product, in which a main mold, in which a product is molded, is connected with an auxiliary mold, and molten material in the auxiliary mold moves toward the main mold by adjusting a cooling time between the main mold and the auxiliary mold, thereby preventing voids from occurring in the middle portion of the molded product having a large thickness or various thicknesses, preventing sink marks from occurring at the molded product having a small thickness, and enhancing mechanical rigidity and reliability of the molded product. The method includes the steps of: preparing a main mold by which a product to be molded is molded and an auxiliary mold connected with the main mold; introducing molten resin into the auxiliary mold and the main mold; and retarding cooling of the auxiliary mold such that negative pressure in the auxiliary mold is different from that in the main mold due to a cooling time difference and a temperature difference. The molten resin in the auxiliary mold moves toward the main mold, and then is filled in the main mold in which the voids occur during the cooling.</p>
申请公布号 WO2007139292(A1) 申请公布日期 2007.12.06
申请号 WO2007KR02246 申请日期 2007.05.08
申请人 POLYTEC CO., LTD;YU, GI-JONG;KWON, GU-SEOB 发明人 YU, GI-JONG;KWON, GU-SEOB
分类号 B29C45/72 主分类号 B29C45/72
代理机构 代理人
主权项
地址