ARRANGEMENT FOR HEAT DISSIPATION

摘要

The invention relates to an arrangement for heat dissipation. The arrangement comprises a printed circuit board and at least one electrical and/or electronic component, with a power supply unit supplying electrical power to the electrical and/or electronic component (21). The power supply unit and the electrical and/or electronic component make electrical contact, and are thermally coupled. The power supply unit is also used for dissipation of thermal power losses from the electrical and/or electronic component.