| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component packaging method, with which a circuit board can be miniaturized and further both the bonding quality and production environment of components can be improved by packaging a chip- shaped electronic component and an electronic component with lead can be packaged, while being mixed on the same side of the circuit board. SOLUTION: When packaging a chip-shaped electronic component 3 and an electronic component 2 with lead, while mixing them on a circuit board 9, after adhesive materials 8 and 7 for electrical bonding and component holding are supplied and stuck to prescribed parts on a packaging surface 9a of the circuit board 9, first the chip-shaped electronic component 3 is packaged by the adhesive material 8 for electrical bonding, and next the electronic component 2 with a lead is packaged, while bringing the top end of a lead 2b into contact with the adhesive material 8 for electrical bonding in a state of placing a component body 2a of that component on the top of the adhesive material 7 for component mounting. Then, the chip-shaped electronic component 3 and the electronic component 3 with a lead are fixed via the adhesive material 8 for electrical bonding to the circuit board 9 in the electrically connected state by the bonding technique method of reflow. |
