| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali developable solder resist ink composition excellent in durability against a water-soluble flux, durability against tin plating, touch drying property after temporal drying, developing life and photosensitivity, and also to provide its hardened product. <P>SOLUTION: The composition contains an unsaturated group-containing polycarboxylic acid resin (A), a diluent (B) and a polyfunctional epoxy compound (C). The resin (A) is prepared by reacting an epoxy compound (a) which is a reaction product of an epoxy resin expressed by formula 1, wherein n is 1 or a number larger than 1, and epichlorohydrin and having 55 to 64°C softening point with an ethylenically unsaturated group-containing monocarboxylic acid (b) and further reacting the above reaction product with a succinic acid anhydride (c). <P>COPYRIGHT: (C)2004,JPO |
