摘要 |
<p>A two-phase cooling system (2) for cooling power electronic components (1) comprises a condenser section (22) and an evaporator section (21), each with at least two metal sheets (23, 23') partially bonded together, the at least two metal sheets (23, 23') forming at least one first (4) fluid channel or second fluid channel, respectively being arranged between two bonded areas of the at least two metal sheets (23, 23'). These channels form a continuous, sealed fluid channel, which connects the condenser and evaporator sections (21, 22). A power electronic element (1) can be arranged on a first main side (211) of the evaporator section (21) within a contact area (213), and the two-phase cooling system (2) can be pressed against the power electronic component (1). A support plate (5) is arranged on a second main side (212) of the evaporator section (21), the second main side (212) being opposite the first main side (211). The support plate (5) comprises at least one projecting part (51), which contacts the evaporator section (21) within the at least one bonded area or at least one support element is arranged within the at least one first fluid channel (4).</p> |