| 摘要 |
An epoxy resin composition for rigid-flex printed circuit boards is provided to form no powder when a prepreg is punch-processed, facilitate laminating through control of flowability, and ensure excellent adhesiveness with copper foils and polyimides. An epoxy resin composition for rigid-flex printed circuit boards includes (a) a rubber-modified epoxy resin, a dimer-modified epoxy resin, or a mixture thereof, (b) a multi-functional epoxy selected from the group consisting of aromatic novolac epoxy resins and isocyanate-modified epoxy resins, (c) a brominated epoxy resin, (d) an aliphatic amine-based hardener and an aromatic amine-based hardener, and (e) a solvent, wherein the hardening temperature difference between the aliphatic amine-based hardener and aromatic amine-based hardener is at least 20 °C or above.
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