| 发明名称 |
Method for fabricating self-assembling microstructures |
| 摘要 |
<p>A method of fabricating shaped blocks comprising an integrated circuit device, comprising the steps of: providing a substrate (10) having a top surface (15) and a backside; growing a sacrificial layer (13) overlying said top surface; forming a block layer overlying said top surface; and masking and etching said block layer up to said sacrificial layer forming a plurality of shaped blocks (19) on and in contact with said sacrificial layer. <IMAGE></p> |
| 申请公布号 |
EP1463116(A3) |
申请公布日期 |
2007.12.05 |
| 申请号 |
EP20040014244 |
申请日期 |
1994.12.07 |
| 申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
SMITH, JOHN STEPHEN;YEH, HSI-JEN J. |
| 分类号 |
H01L21/302;H01L25/16;B65G49/02;G02F1/136;G02F1/1362;G02F1/1368;H01L21/02;H01L21/306;H01L21/3065;H01L21/50;H01L21/52;H01L21/58;H01L21/677;H01L21/68;H01L21/78;H01L21/98;H01L23/13;H01L23/14;H01L25/04;H01L25/065;H01L25/075;H01L27/12;H01L27/15;H01L29/06;H01L29/88;H01L33/20;H01S5/022;H01S5/40 |
主分类号 |
H01L21/302 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
