A method for forming a capacitor is provided to form easily a dielectric layer and an upper electrode on a lower electrode by widening a lower width of the lower electrode in an upper width of the lower electrode. A lower mold layer is formed on a substrate(100). An upper mold layer is formed on the lower mold layer. An etch ratio of a material for forming the upper mold layer is lower than an etch ratio of a material for forming the lower mold layer. A first mold layer pattern including a first opening having a narrow width by etching partially the lower mold layer and the upper mold layer in an anisotropic etch manner. A second mold layer pattern including a second opening having a wide width by etching the lower mold layer exposed to a sidewall of the first opening by using an etch solution. A lower electrode(142) is formed along a surface of the second mold layer pattern exposed to an inner wall of the second opening. A third mold layer pattern is formed to surround a lower part of the lower electrode by removing a part of the upper mold layer. A dielectric layer(144) and an upper electrode are formed along the third mold layer pattern and the surface of the lower electrode.
申请公布号
KR20070114952(A)
申请公布日期
2007.12.05
申请号
KR20060048658
申请日期
2006.05.30
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KANG, DAE HYUK;HAN, DONG GYUN;LEE, MONG SUP;HONG, CHANG KI;LEE, KUN TACK;PARK, IM SOO