PROCESS CHAMBER STRUCTURE FOR ELIMINATING PARTICLES FOR USE IN SEMICONDUCTOR DEVICE FABRICATION EQUIPMENT

摘要

A process chamber structure for eliminating particles for use in semiconductor device fabrication equipment is provided to improve wafer failure caused by particles with respect to wafers located on a level around a vacuum pumping line by using a gas flow dispersion unit for reducing or minimizing particles around the vacuum pumping line. A process chamber(10) for a cylindrical sealing space is prepared. Gas inlet lines supply a process gas to the process chamber. A vacuum pumping line(40) is installed around a center of the process chamber to maintain the inside of the process chamber in a vacuum condition. A gas flow dispersion unit(100) is installed in the process chamber by maintaining a certain space at the front of the vacuum pumping line. The gas flow dispersion unit disperses gas flow in the process chamber to an upper portion and a lower portion of the process chamber to exhaust the gas through the vacuum pumping line.