| 发明名称 |
MANUFACTURE OF VOID-FREE LAMINATES AND USE THEREOF |
| 摘要 |
<p>The present invention provides a resin composition useful in manufacturing void-free laminates. The resin composition comprises: (a) from about 70 to about 90 weight percent of a tris (hydroxyphenyl)methane based epoxy semi-solid resin; and (b) from about 10 to about 30 weight percent of a tetraglycidylmethylenedianiline liquid resin.</p> |
| 申请公布号 |
CA2511567(C) |
申请公布日期 |
2007.12.04 |
| 申请号 |
CA19992511567 |
申请日期 |
1999.05.20 |
| 申请人 |
CYTEC TECHNOLOGY CORPORATION |
发明人 |
MORTIMER, STEVE;BOYD, JACK;PEAKE, STEVE;REPECKA, LINAS;XU, GUO FENG |
| 分类号 |
C08L63/00;B29C70/44;B29C70/54;B32B5/02;B32B5/26;B32B17/04;C08G59/32;C08G59/38;C08G59/44;C08G59/50;C08J5/24;C08K5/21;C08K5/3445;C08L63/02;C08L63/04 |
主分类号 |
C08L63/00 |
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