| 摘要 |
Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a semiconductor wafer polishing apparatus of the present invention has a polishing unit polishing the circumferential edge side of a disc-formed wafer; and a gas blowing unit blowing a gas G against the surface of the wafer, so as to separate the space over the wafer by a curtain C of the gas G between a polishing field PF in which the wafer is polished by the polishing unit and a normal field NF except the polishing field PF.
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