发明名称 High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture
摘要 A semiconductor device and method of manufacturing a semiconductor device. The semiconductor device includes channels for a pFET and an nFET. A SiGe layer is selectively grown in the source and drain regions of the pFET channel and a Si:C layer is selectively grown in source and drain regions of the nFET channel. The SiGe and Si:C layer match a lattice network of the underlying Si layer to create a stress component. In one implementation, this causes a compressive component in the pFET channel and a tensile component in the nFET channel.
申请公布号 US7303949(B2) 申请公布日期 2007.12.04
申请号 US20030689506 申请日期 2003.10.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHEN HUAJIE;CHIDAMBARRAO DURESETI;DOKUMACI OMER H
分类号 H01L21/8238;H01L;H01L21/22;H01L21/302;H01L21/31;H01L21/336;H01L21/44;H01L21/461;H01L21/84;H01L27/01;H01L27/12;H01L29/10;H01L31/00;H01L31/117 主分类号 H01L21/8238
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