发明名称 Polishing composition
摘要 A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles in the range of particle sizes of from 40 to 100 nm satisfy the following formula (1): V>=0.5xR+40 (1), wherein the particle size is determined by observation with a transmission electron microscope (TEM). The polishing composition of the present invention can be even more suitably used for the manufacture of a substrate for precision parts such as substrates for memory hard disks.
申请公布号 US7303601(B2) 申请公布日期 2007.12.04
申请号 US20030727571 申请日期 2003.12.05
申请人 KAO CORPORATION 发明人 SUENAGA KENICHI;OSHIMA YOSHIAKI;HAGIHARA TOSHIYA
分类号 B24B37/00;C09G1/02;B24B1/00;C09K3/14;G11B5/84 主分类号 B24B37/00
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